HomeElectronicsSenior Engineer II - IC Bundle Design At Microchip In Bengaluru And...

Senior Engineer II – IC Bundle Design At Microchip In Bengaluru And Chennai


Areas: Bengaluru and Chennai

Firm: Microchip

About The Job

Division: Blended-Sign Improvement Group, Superior Engineering Providers

Title: Senior-2, IC Bundle Engineer

The Blended Sign Improvement Group is accountable for delivering analog and mixed-signal IP to divisions inside Microchip. We work with vanguard CMOS processes to supply analog built-in circuits for storage and wireline purposes. From T1/E1 to 56Gb/s SERDES, we allow expertise that permits Microchip’s merchandise to interface to the surface world.

As a member of the Blended-Sign Improvement Group, the candidate will probably be supervised by a workforce chief/supervisor, and be engaged within the package deal design and format.

Duties

  • Conduct package deal routing feasibility and layouts for Microchip high-speed merchandise, together with MCM packages
  • Carry out easy PCB breakout research for ball map feasibility
  • Establish key points for proposed designs primarily based on silicon ground plans and desired package deal sizes
  • Work with sign integrity engineers to implement high-speed sign routes and quiet energy routes
  • Work with reliability engineers and exterior distributors to make sure manufacturability of package deal designs
  • Create package deal routing constraints primarily based on sign integrity routing guidelines
  • Work together with and oversee work of exterior and inside package deal designers
  • Produce package deal routing studies and diagrams for overview by exterior groups
  • Create and observe package deal design schedules
  • Information and help exterior design groups on the creation of enter information for the package deal design stream.

Necessities/{Qualifications}:

  • Relevant Bachelor’s or Grasp’s Diploma
  • 6+ years of business expertise
  • Professional in package deal design utilizing Cadence APD
  • Professional in authoring APD design guidelines
  • Scripting in PERL or SKILL is an asset
  • Familiarity with flip-chip and wire-bond package deal designs
  • Familiarity with PCB design and BGA fanout points
  • Understanding of high-speed and energy routing guidelines/points
  • Able to dealing with a number of duties directly
  • Buyer-oriented, with consideration to element

RELATED ARTICLES

LEAVE A REPLY

Please enter your comment!
Please enter your name here

- Advertisment -
Google search engine

Most Popular

Recent Comments