HomeElectronics{Hardware} Design Intern At TechLanz In Bengaluru

{Hardware} Design Intern At TechLanz In Bengaluru


Location: Bengaluru

Firm: Bengaluru

Place Overview

Be a part of the {Hardware} R&D crew as an Embedded {Hardware} Design Intern, the place you’ll assist flip product ideas into sturdy, testable digital prototypes. You’ll work alongside senior {hardware}, firmware, and manufacturing engineers on schematic seize, PCB format help, bring-up, and lab validation—gaining actual, hands-on publicity to embedded techniques utilized in client, IoT, and industrial purposes.

Job Tasks

  • Help in schematic seize for MCU-, sensor-, and power-based circuits utilizing Altium/KiCad below steering.
  • Contribute to PCB format actions (layer stack selections, placement, routing, DRC fixes) and put together fabrication/meeting information (Gerbers, BOM, pick-and-place).
  • Help board bring-up: solder/rework prototypes, power-on testing, interface checks (I²C, SPI, UART), and primary firmware flashing by way of JTAG/SWD.
  • Execute lab validation utilizing oscilloscope, logic analyzer, DMM, and energy provides; log measurements and anomalies with clear check notes.
  • Debug widespread {hardware} points (sign integrity, noise, grounding, energy rails) with systematic root-cause evaluation.
  • Carry out part choice from datasheets; create and keep symbols/footprints and correct BOMs.
  • Run primary simulations (LTspice/PSPICE) for filters, energy levels, and sign chains; evaluate outcomes with bench knowledge.
  • Take part in design critiques; seize actions, implement fixes, and replace documentation/model management (Git).
  • Help DFM/DFT readiness: footprints, test-points, panelization inputs, and meeting tips for EMS companions.
  • Help in pre-compliance checks for EMI/EMC and ESD dealing with practices; doc findings and suggest mitigations.
  • Collaborate with firmware/mechanical groups to resolve electro-mechanical match, connector pinouts, and interface timing.
  • Put together concise construct stories, check plans, and person notes for inner and manufacturing stakeholders.

{Qualifications}, Expertise, Abilities

  • B.E./B.Tech or M.E./M.Tech in ECE/EEE (final-year or latest graduate); sturdy analog/digital electronics fundamentals.
  • Familiarity with schematic/PCB instruments (Altium Designer or KiCad/Eagle) and library administration (symbols, footprints, 3D).
  • Working data of microcontrollers (STM32/ESP32/AVR) and customary interfaces: I²C, SPI, UART, GPIO, ADC/DAC.
  • Fingers-on with lab gear (oscilloscope, logic analyzer, DMM, bench PSU) and secure ESD practices.
  • Fundamentals of energy electronics (buck/enhance regulators, LDOs), decoupling, grounding, and sign integrity.
  • Capacity to learn datasheets, create BOMs, and carry out part derating/alternate identification.
  • Publicity to circuit simulation (LTspice/PSPICE/Multisim) and easy worst-case/thermal checks most popular.
  • Understanding of prototyping workflows (reflow/soldering, rework) and bring-up/board-level debugging.
  • Bonus: consciousness of EMI/EMC concerns, IEC/BIS security norms, and DFM/DFT for quantity manufacturing.
  • Robust documentation habits, model management (Git), curiosity, and willingness to study in a fast-paced atmosphere.

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