With decrease energy losses, larger thermal endurance, and simplified integration, the expertise guarantees to chop system prices whereas boosting reliability throughout industries racing towards electrification and digital infrastructure.
The race for compact, environment friendly, and dependable energy electronics is accelerating—and Microchip is responding with a brand new lineup of DualPack 3 (DP3) IGBT7 modules that goal to simplify design whereas scaling efficiency throughout high-growth sectors like motor drives, knowledge facilities, renewable power, and electrical mobility.
On the coronary heart of the DP3 household is superior IGBT7 expertise, which delivers as much as 15–20% decrease switching and conduction losses in comparison with previous-generation IGBT4 gadgets. Designed for rugged environments, the modules can function at junction temperatures as much as 175°C below overload circumstances, giving system designers extra headroom for reliability and effectivity in power-intensive setups.
The important thing options are:
- Voltage courses: 1200V and 1700V
- Present rankings: 300A to 900A
- Section-leg configuration
- Compact footprint: ~152 × 62 × 20 mm
- Larger energy output with out paralleling a number of modules
This interprets into simplified layouts, lowered Invoice of Supplies (BOM), and decrease system prices—important components as industries look to streamline converter designs. A key differentiator for DP3 is its positioning as a second-source choice to industry-standard EconoDUAL™ packages. That flexibility not solely strengthens provide chain resilience but additionally opens the door for design portability with out in depth re-engineering. Past {hardware}, the modules combine seamlessly with the corporate’s broader ecosystem of microcontrollers, safety parts, and connectivity options, providing builders a path to sooner prototyping and shorter time-to-market.
Utility areas are numerous: from general-purpose industrial drives to renewables, power storage techniques, traction in e-mobility, and even agricultural automobiles. In all circumstances, the DP3 modules are engineered to handle acquainted design ache factors equivalent to dv/dt stress, larger conduction losses, and overload limitations. By combining excessive present rankings, lowered switching losses, and compact packaging, Microchip’s DualPack 3 IGBT7 modules carry a mix of efficiency and practicality tailor-made to the evolving calls for of electrification and digital infrastructure.
