What’s 3D IC, and what’s inflicting the shift from 2D IC to 3D IC? How does this new know-how relate to heterogeneous integration and superior packaging? What’s required for a profitable 3D IC implementation? EDN lately printed a three-article sequence to cowl a number of aspects of this superior packaging know-how.
Beneath is a sneak peek at this three-article sequence, which explains 3D IC fundamentals, microarchitectures, toolkits, and design use instances.
Half one, titled “Making your structure prepared for 3D IC”, offered important context and technical depth for design engineers working towards extremely built-in, environment friendly, and resilient 3D IC techniques. It explains 3D IC microarchitectures that redefine how information and controls transfer via a system, how blocks are partitioned and co-optimized throughout each horizontal and vertical domains, and the way early-stage design selections tackle the distinctive challenges of 3D integration.
Making your structure prepared for 3D IC
Half two, titled “Placing 3D IC to give you the results you want”, outlines the challenges and alternatives in adopting 3D IC know-how. It demonstrates how 3D IC allows environment friendly chiplet integration and reuse, accelerates innovation, and ensures manufacturability throughout organizational boundaries. The article additionally supplies an in depth examination of 3D IC design toolkits and workflows, in addition to their incorporation of AI know-how.
Placing 3D IC to give you the results you want
The third and last half, titled “Automating FOWLP design: A complete framework for next-generation integration”, presents fan-out wafer-level packaging (FOWLP) as a case research, displaying how automation frameworks handle the inherent complexity of superior packaging and the dimensions of recent layouts, racking up hundreds of thousands of pins and tens of 1000’s of nets. It additionally demonstrates how efficient frameworks promote collaboration amongst package deal designers, format specialists, sign and energy integrity analysts, and thermal and mechanical engineers.
Automating FOWLP design: A complete framework for next-generation integration
Associated Content material
- 3D IC Design
- Thermal evaluation instrument goals to reinvigorate 3D-IC design
- Heterogeneous Integration and the Evolution of IC Packaging
- Tighter Integration Between Course of Applied sciences and Packaging
- Superior IC Packaging: The Roadmap to 3D IC Semiconductor Scaling
The submit A crash course in 3D IC know-how appeared first on EDN.
