The sixth version of IEEE WINTECHCON 2025 convened over 800 ladies engineers, technologists, trade leaders, academia, college students, and researchers from November 12 – 13, 2025, beneath the theme “Reworking the Future with Information-Pushed Improvements within the Semicon-Verse.”
Organized by IEEE Bangalore Part, IEEE CAS Bangalore Chapter, and Ladies in Engineering AG Bangalore Part, the convention was hosted by Samsung Semiconductor India Analysis (SSIR), this 12 months.
Dr. Chandrakanta Kumar, Chair of the IEEE Bangalore part, stated, “IEEE Wintechcon 2025 showcased the power and momentum of India’s semiconductor innovation engine. The shift towards data-driven and AI-enabled design is redefining what is feasible in chip and system improvement, and this discussion board introduced collectively the leaders shaping that future. The robust trade and educational participation displays a transparent perception that advancing semiconductor expertise calls for each technical excellence and inclusive management”.
The convention featured keynotes by Jaya Jagadish, Nation Head and Senior Vice President of Silicon Design Engineering at AMD; Rajesh Krishnan, Senior Vice President and Managing Director, SSIR; Savithri Seetharaman, Vice President at Texas Devices; and Sonali Jayswal, Director of System Software program at NVIDIA. Garima Srivastava (SSIR) and Puneet Mishra (IEEE) served because the Basic Chairs for this occasion.
Rajesh Krishnan, Senior Vice President and Managing Director, SSIR. “Internet hosting IEEE Wintechcon 2025 was a privilege to showcase the engineering excellence driving the subsequent technology of semiconductor and methods innovation. India stands at a pivotal juncture — with distinctive expertise and powerful technical rigor, the sector is poised to guide globally. At SSIR, we’re advancing this trajectory via cutting-edge R&D, long-term ecosystem partnerships, democratising AI adoption and a targeted dedication to nurturing ladies engineers into technical and product management roles that can form the trade’s future.”
Key takeaways
The 2-day program included deep technical classes throughout each digital and in-person codecs. Tracks reminiscent of “Clever Silicon” and “Interstellar Improvements” coated GenAI-powered digital twins, 3D IC integration, superior packaging, and design-for-test architectures, that includes audio system from Samsung, IBM, Western Digital, Cadence, and Texas Devices. Day two hosted 5 parallel paper tracks on AI accelerators, embedded methods, VLSI architectures, and semiconductor packaging, complemented by expertise cubicles, poster classes, and hands-on demos. A particular Masterclass, “From Engineer to Govt,” supplied profession and management insights for rising ladies in STEM.
The following version of IEEE WINTECHCON will likely be held in November 2026, in Bengaluru, India.
