Vorago has introduced 4 rad-tolerant MCUs for LEO missions, which it says value far lower than standard space-grade elements. A part of the VA4 collection of rad-hardened MCUs, these new chips present a cost-effective different to high-risk upscreened COTS elements.
Primarily based on Arm Cortex-M4 processors, the Radiation-Tolerant by Design (RTbD) MCUs are priced almost 75% decrease than Vorago’s HARDSIL radiation-hardened merchandise. The RTbD lineup contains the extended-mission VA42620 and VA42630, in addition to the cost-optimized VA42628 and VA42629 for short- or lower-orbit missions. By embedding radiation safety immediately into the silicon, these MCUs sort out the reliability challenges of satellite tv for pc constellations and supply a extra environment friendly answer than standard multi-chip redundancy approaches.
All 4 MCUs present >30 krad(Si) TID tolerance, with the VA42630 integrating 256 KB of nonvolatile reminiscence. Prolonged-mission units are designed for harsher obits and first flight management, whereas cost-optimized MCUs goal thermal regulation and localized energy administration. These chips could be dropped into current architectures with no redesign, enabling fast deployment.
Vorago will start transport its first rad-tolerant chips in early Q1 2026.
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