Caliber Interconnects Pvt. Ltd., introduced that it has achieved accelerated turnaround instances and first-time-right outcomes for complicated chiplet and Automated Take a look at Gear (ATE) {hardware} initiatives. The corporate has refined its proprietary design and verification workflow, which integrates highly effective Cadence options to optimize efficiency, energy, and reliability from the earliest phases of design.
Caliber’s superior methodology considerably enhances the effectivity and precision of designing high-complexity IC packages and dense PCB layouts. By leveraging the Cadence Allegro X Design Platform for PCB and superior bundle designs, which options sub- rawing administration and auto- routing, Caliber’s groups can work in parallel throughout numerous circuit blocks, compressing general mission timelines by as much as 80 %. This streamlined framework is strengthened by a rigorous in-house verification course of and customized automation utilities developed utilizing the Allegro X Design Platform’s SKILL-based scripting, guaranteeing constant high quality and compliance with design guidelines.
To satisfy the calls for of next-generation interconnects working at over 100 Gbps, Caliber’s engineers make the most of Cadence’s Sigrity X PowerSI and Sigrity X PowerDC options. These superior simulation instruments permit the workforce to research essential components akin to sign loss, crosstalk, and energy supply community (PDN) impedance. By totally evaluating IR drop, present density, and Joule heating, Caliber can confidently ship design signoff, decreasing the danger of pricey respins and dashing time to marketplace for its clients.
“Our workforce has elevated our engineering management by making a disciplined workflow that delivers distinctive high quality and sooner turnaround instances for our clients throughout the semiconductor ecosystem,” stated Suresh Babu, CEO of Caliber Interconnects. “Integrating Cadence’s superior design and simulation setting into our proprietary methodology empowers us to push the boundaries of efficiency and reliability in complicated chiplet and ATE {hardware} design.”
