Location: Bengaluru
Firm: ARM
You may be concerned with techniques that incorporate Arm processors, specializing in features like chip packaging and System-on-Chip (SoC) integration. We develop bodily {hardware} platforms used for software program growth and validation actions for each exterior companions/clients and our inside growth groups. The group is working on the forefront of embedded compute, specializing in prototyping Arm’s newest IP merchandise.
Duties
Collaborate with engineering groups throughout a number of geographies to specify, consider, analyse and develop options for optimum PCB and silicon bundle integration. Give attention to driving the PCB growth alongside the chip packaging group, together with brainstorming breakout and routing methods, design guidelines and layer optimisation to make sure optimum efficiency, reliability, and cost-effectiveness. Present timescale estimates and justifications to this system group.
Required Abilities and Expertise
- Robust understanding of electronics and embedded compute techniques.
- Familiarity with completely different IC packaging applied sciences and their influence on PCB design to make sure seamless integration of SoCs, guaranteeing correct sign routing and energy supply.
- Expertise of collaborating with chip packaging groups. Means to affect and drive SoC system pin-outs for value optimisation, routing feasibility and layer trade-off evaluation.
- Detailed information of high-speed design and interface requirements (e.g. PCIe and DDR reminiscence applied sciences). You’ll analyse and optimise sign paths to make sure sign high quality, minimise noise, and stop sign degradation, particularly at excessive speeds.
- Experience in escape routing evaluation of high-density SoC’s and in a position to present estimates of the IO depend that may be routed with a selected stack-up and design rule set.
- Intensive information of Sign and Energy Integrity evaluation strategies from each board design and chip packaging views.
- Understanding of the PCB fabrication course of (PTH and HDI), stackup/VIA topologies and substrate supplies. Means to collaborate with PCB fabricators and CEMs.
- Proficiency in the usage of EDA instruments, particularly Cadence Allegro PCB suite and OrCAD CIS.
- Good communication and interpersonal abilities. Constructive can-do angle and a focus to element.
Fascinating Abilities And Qualities
The next abilities usually are not important, however expertise in any of the next areas would improve the applying:
- Expertise in utilizing Sign Integrity instruments from ANSYS, Siemens EDA and so on.
- Expertise of design automation and scripting.
- Get pleasure from collaborating and dealing in throughout geographies with a number of groups.
