The marketplace for electrical autos continues to assemble tempo with a robust quantity progress of each battery electrical autos and plug-in hybrid electrical autos. The share of electrical autos produced is anticipated to see double-digit progress by 2030 with a share of round 45 % in comparison with 20 % in 2024. Infineon Applied sciences AG is responding to the rising demand for high-voltage automotive IGBT chips by launching a brand new technology of merchandise. Amongst these choices are the EDT3 (Electrical Drive Practice, 3rd technology) chips, designed for 400 V and 800 V techniques, and the RC-IGBT chips, tailor-made particularly for 800 V techniques. These units improve the efficiency of electrical drivetrain techniques, making them notably appropriate for automotive functions.
The EDT3 and RC-IGBT naked dies have been engineered to ship high-quality and dependable efficiency, empowering clients to create customized energy modules. The brand new technology EDT3 represents a big development over the EDT2, reaching as much as 20 % decrease complete losses at excessive hundreds whereas sustaining effectivity at low hundreds. This achievement is because of optimizations that reduce chip losses and enhance the utmost junction temperature, balancing high-load efficiency and low-load effectivity. Because of this, electrical autos utilizing EDT3 chips obtain an prolonged vary and scale back vitality consumption, offering a extra sustainable and cost-effective driving expertise.
“Infineon, as a number one supplier of IGBT expertise, is dedicated to delivering excellent efficiency and reliability”, says Robert Hermann, Vice President for Automotive Excessive Voltage Chips and Discretes at Infineon Applied sciences. “Leveraging our steadfast dedication to innovation and decarbonization, our EDT3 resolution permits our clients to realize preferrred leads to their functions.”
The EDT3 chipsets, which can be found in 750 V and 1200 V courses, ship excessive output present, making them well-suited for principal inverter functions in a various vary of electrical autos, together with battery electrical autos, plug-in hybrid electrical autos, and range-extended electrical autos. Their lowered chip dimension and optimized design facilitate the creation of smaller modules, consequently resulting in decrease total system prices. Furthermore, with a most digital junction temperature of 185°C and a most collector-emitter voltage score of as much as 750 V and 1200 V, these units are well-suited for high-performance functions, enabling automakers to design extra environment friendly and dependable powertrains that may assist prolong driving vary and scale back emissions.
“Infineon, as Leadrive’s major IGBT chip provider and companion, constantly offers us with modern options that ship system-level advantages,” stated Dr. Ing. Jie Shen, Founder and Normal Supervisor of Leadrive. “The most recent EDT3 chips have optimized losses and loss distribution, help larger working temperatures, and supply a number of metallization choices. These options not solely scale back the silicon space per ampere, but additionally speed up the adoption of superior packaging applied sciences.”
The 1200 V RC-IGBT elevates efficiency by integrating IGBT and diode features on a single die, delivering an excellent larger present density in comparison with separate IGBT and diode chipset options. This development interprets right into a system price profit, attributed to the elevated present density, scalable chip dimension, and lowered meeting effort.
Infineon’s newest EDT3 IGBT chip expertise is now built-in into the HybridPACK Drive G2 automotive energy module, delivering enhanced efficiency and capabilities throughout the module portfolio. This module gives an influence vary of as much as 250 kW throughout the 750 V and 1200 V courses, enhanced ease of use, and new options equivalent to an integration possibility for next-generation part present sensors and on-chip temperature sensing, contributing to system price enhancements.
All chip units are supplied with custom-made chip layouts, together with on-chip temperature and present sensors.
