Apple is planning to overtake its chip design for the 2026 iPhones, in a transfer that would mark the primary time it makes use of superior multi-chip packaging in a cellular gadget. It sounds difficult, however right here’s what this implies.
Based on analyst Jeff Pu in a brand new report for GF Securities, the iPhone 18 Professional, 18 Professional Max, and the long-rumored iPhone 18 Fold are anticipated to debut Apple’s A20 chip, constructed on TSMC’s second-gen 2nm course of (N2).
However that’s solely a part of the story. The extra fascinating bit is how these chips will probably be assembled.
How these chips will probably be assembled
For the primary time, Apple is ready to undertake Wafer-Degree Multi-Chip Module (WMCM) packaging for its iPhone processors. WMCM permits totally different elements, just like the SoC and DRAM, to be built-in instantly on the wafer stage, earlier than being diced into particular person chips.
It makes use of a way that connects the dies while not having an interposer or substrate, which might carry each thermal and sign integrity advantages.
In different phrases, Apple’s next-gen chip gained’t simply be smaller and extra power-efficient due to N2. It’ll even be bodily nearer to its onboard reminiscence, enabling higher efficiency and doubtlessly decrease energy consumption for duties like AI processing and high-end gaming.
Behind the scenes, Pu stories TSMC is constructing a devoted manufacturing line and expects to shortly ramp up by 2027:
“TSMC will set up a devoted WMCM manufacturing line at its AP7, leveraging gear and course of much like CoWoS-L with out on-substrate. We see TSMC is making ready capability of as much as 50KPM by finish of 2026 and estimate the capability to achieve 110-120KPM by end-2027, because of the enhance in adoption.”
What this implies
For Apple, this can be a massive leap in chip design, much like when it adopted 3nm forward of a lot of the business. And for the broader cellular market, it means that applied sciences as soon as reserved for knowledge heart GPUs and AI accelerators are making their manner into smartphones.
And for those who’re questioning what this implies for the iPhone 18 Fold: it appears Apple isn’t simply reserving its most novel {hardware} for its type issue. It could even be the corporate’s testbed for next-gen silicon packaging.
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