Rohm has launched the DOT-247, a 2-in-1 SiC molded module that mixes two TO-247 units to ship greater energy density. The twin construction accommodates bigger chips, whereas the optimized inside design lowers on-resistance. Package deal enhancements minimize thermal resistance by roughly 15% and cut back inductance by about 50% in contrast with customary TO-247 units. Rohm studies a 2.3× enhance in energy density in a half-bridge configuration, enabling the identical conversion functionality in practically half the quantity.
The 750-V and 1200-V units goal industrial energy methods akin to PV inverters, UPS models, and semiconductor relays, and are supplied in half-bridge and common-source configurations. Whereas two-level inverters stay customary, demand is rising for multi-level circuits—together with three-level NPC, three-level T-NPC, and five-level ANPC—to assist greater voltages. These superior topologies usually require customized designs with customary SiC packages because of the complexity of mixing half-bridge and common-source configurations.
Rohm addresses this problem with standardized 2-in-1 modules supporting each topologies, offering better flexibility for NPC circuits and DC/DC converters. This method reduces part rely and board area, enabling extra compact designs in contrast with discrete options.
Units within the 750-V SC740xxDT sequence and 1200-V SCZ40xxKTx sequence can be found now in OEM portions. Samples of AEC-Q101 certified merchandise are scheduled to start in October 2025.
The put up 2-in-1 SiC module raises energy density appeared first on EDN.
